JSR's unique THB series of negative tone resists address the needs of metal plating and bumping processes using a proprietary design that incorporates a polymer backbone with multifunctional acrylate groups. Excellent plating tolerance and ease of stripping allow JSR THB negative tone photoresists to provide fast processing with excellent exposure throughput and superior process margins. The acrylate groups in the THB series resist cross-link on exposure and are developable in standard TMAH yielding high aspect ratio profiles for film thicknesses from 5 to 90 µm.
|Film Thickness (µm)
|Copper, solder bump
RDL for copper plating for wafer level CSP system in package
Gold bump - LCD driver inner bump
Solder plating, copper plating - flip chip, wafer level CSP system in package