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Spin-on Dual Hard Mask Material
JSR Carbon Underlayer:
High carbon content
Low outgassing performance
Low bake temperatures
Excellent filling and planarization control
JSR ISX Si Hardmask:
Excellent shelf-life
Good reworkability
Organic BARC-like properties
Resis compatible, reflectivity control, etc.
High Si content; FT = ~30nm
Multilayer results: 42nm 1:1
Electronic Materials
Lithography
ArF & KrF Dry Imaging
ArF immersion
EUV
Multilayer Hardmask
Packaging Materials
THB
WPR
Advanced Cleans and CMP
Post Etch Cleans
Post CMP Cleans
CMP Slurry
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