- Novel directed self-assembly (DSA) technology viable for the sub-20nm half-pitch node
- Silicon-containing, blended polymer system, which allows for more flexible use in both logic and memory applications
- Good etch selectivity due to the silicon
- The simplicity of the blended DSA system provides additional benefits such as the ability to utilize existing 193nm infrastructure for the guidelines and eliminate dual exposure steps resulting in shorter processing times and lower cost of ownership.
Sidewall Image Transfer with Phase Separation of Si Containing Polymer Blend
Polymer-blend-based Si-containing DSA