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Thick Photoresist  

JSR's unique THB series of negative tone resists address the needs of metal plating and bumping processes using a proprietary design that incorporates a polymer backbone with multifunctional acrylate groups.

Excellent plating tolerance and ease of stripping allow JSR THB negative tone photoresists to provide fast processing with excellent exposure throughput and superior process margins. The acrylate groups in our THB series resists cross-link on exposure and are developable in standard TMAH yielding high aspect ratio profiles for film thicknesses from 10 to 100 mm. Contact your local JSR sales representative for a "One-on-One" discussion about these innovative materials.

Benefits

  • Fast Processing
  • High Sensitivity
  • Wide Process Margin
  • Excellent Plating Resistance
  • High Resolution
  • High Aspect Ratio


PRODUCT SUMMARY
Product Film Thickness (mm) Application
THB 110N 5-15 Copper Wiring
THB 126N 15-50 Au, CuNi, Solder
THB 151N 25-100 Bump/Wiring

THB 110N

Application
Reroute for Copper Plating
for Wafer Level CSP
System in Package

 

 

Post Copper Plating
and Resist Strip



THB 151N

Application:
Solder plating, Copper plating -
Flip Chip, Wafer Level CSP
System in Package

   
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