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Low-k Dielectrics

JSR Spin-on Dielectric Materials Line Up General Trends - E-beam vs. Thermal Cure Process diagram of JSR LKD	3LM Lot & Package Results TEM Image All spin-on DD stuck build

JSR Spin-on Dielectric Materials Line Up

General Trends - E-beam vs. Thermal Cure

Process diagram of JSR LKD

Solvent for LKD-XXXX: Propyleneglycol monopropylether(PFG, CAS# 1569-01-3 )
Local exhaust : Effusion to environment from roof-top exhaust after passing condenser.
Solid & liquid waste : Incineration.

3LM Lot; 0.3 mm Via Chain

Package Results; Gold Wirebond II

Structure to support packaging activity to mimic real-world integration.

(K. Mosig)

M3 was patterned with M2 (775 level) mask in ATDF with good overlay.

Successful wire bonding and solder bumping (high yield and pull/shear strengths).

(M. Rasco)

TEM Image

LKD-5109	LKD-5530

All spin-on DD stuck build

		Recipe: 1. Trench level LKD etch: Ar/CF4/CH2F2/O2, 102sec 2. FF-02 ES etch & PR strip: N2/O2, 87sec 3. Via level LKD etch: Ar/CF4/CH2F2/O2, 20sec 4. SiC opening: Ar/CF4/CH2F2/N2, 45sec 5. Wet clean

DD etch structures successfully obtained

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