HOME ABOUT JSR PRODUCTS Lithography Packaging Materials CMP Consumables Low-k Dielectrics Others TECHNICAL LIBRARY NEWS & UPDATES CONTACT US JSR CMP Slurry Soft-brasiveTM Technologies Scratch Counts by Various Abrasives Dishing/Erosion Performance with Over Polish Margin (Cu Polish)   Soft-brasiveTM Technologies + = Polymer Abrasives   Colloidal Silica Abrasives   Composite Abrasives   Engineered to achieve low defects and low dishing Provides cushion effect at areas of high local down-force Well-controlled shape and morphology Minimized large particle formation by well-established production process   Back to menu   Scratch Counts by Various Abrasives   Fumed silica Colloidal silica Composite abrasive A Composite abrasive B Polymer abrasive TaN-RR (A/min) 945 625 760 235 65 Soft-brasiveTM Technologies achieve lower scratches and peeling on Low-K.   Back to menu   Dishing/Erosion Performance with Over Polish Margin (Cu Polish) CMS7400 series exhibit excellent Dishing/Erosion performance with wide over polish margin.   Back to menu
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