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The JSR CMP Pad

The JSR CMP Pad is an innovative solid pad design based upon proprietary elastomer technologies and well established polymer alloying methods. The manufacturing process allows fine control over pore size and pore distribution, resulting in a pad firmer than conventional polyurethane pads with controlled surface morphology. The use of press-molding creates pads with better pad-to-pad consistency and performance. The pads can be further enhanced using surface conditioning optimization. This results in superior planarization and low defectivity for the polish. The performance of the JSR CMP Pad can be tuned for specific polish applications through modification of its composition. Contact your local JSR Account Manager for a "One-on-One" discussion about this innovative performance feature.



JSR CMP Pad
Solid Pad containing WSP Compound™


Benefits PHYSICAL PROPERTIES


  • Controlled Surface Morphology
  • Superior Planarization
  • Excellent Pad-to-Pad Consistency

  • Low Defectivity
  • Low Down-force Polish
  • Low-k Dielectric Ready
  • Tuned Performance

Thickness:
2.5 mm (64 mils)

Specific Gravity:
1.025 gm/cm

Hardness:
69 (Shore D)

Configurations available
for all currently used
CMP polishing tools

Grooving can be to
any specification


Proprietary WSP CompoundTM


Surface Micro-texture of JSR CMP Pad
(Inset: 1000x Top Down View)

 

JSR CMP Pad’s solid elastomer material contains uniformly dispersed WSP CompoundTM. During conditioning and polishing, the exposed WSP Compound at the pad surface dissolve in the aqueous environment of the slurry, leaving behind pores which create the texture on the pad surface. WSP Compound embedded in the polymer matrix below the surface remain undissolved, keeping the bulk of the pad solid and giving a pad with superior planarization performance. As the pad wears, new WSP Compound is exposed at the surface. The well controlled WSP Compound size and dispersion results in consistent surface morphology for the life of the pad.


JSR CMP Pad Performance
Applied Materials Mirra


Wafer Count
Wafer Type: 200 mm Copper Blanket
Speeds: 100 rpm platen / 90 rpm carrier
Downforce: 1.4 psi
Conditioner: Fujimori #325-63R
Conditioning Type: In Situ
Slurry: JSR K106 Bulk Copper Slurry
Flow Rate: 300 mL / min

 

Shipping, Handling & Storage

JSR CMP Pads are double bagged and packed in reinforced packing boxes preventing damage to the pads while giving excellent humidity and temperature control. It is recommended that this product be maintained at temperatures in the range of 5ºC – 30ºC (41ºF – 86ºF). Guaranteed shelf life is one year from the date of manufacture when maintained at recommended temperatures. It is recommended that JSR CMP Pads be stored flat in the original packaging.

JSR, JSR Micro and WSP Compound are registered trademarks. All other product or service names are the property of their respective owners. © JSR Micro, Inc.

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