
Surface Micro-texture of JSR CMP Pad
(Inset: 1000x Top Down View)
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JSR CMP Pad’s solid elastomer material contains uniformly dispersed WSP CompoundTM. During conditioning and polishing, the exposed WSP Compound at the pad surface dissolve in the aqueous environment of the slurry, leaving behind pores which create the texture on the pad surface. WSP Compound embedded in the polymer matrix below the surface remain undissolved, keeping the bulk of the pad solid and giving a pad with superior planarization performance. As the pad wears, new WSP Compound is exposed at the surface. The well controlled WSP Compound size and dispersion results in consistent surface morphology for the life of the pad. |