CMP Pads
Formulated with WSP Compound™—water soluble
particles adjust to provide superior planarization, consistency,
controlled surface morphology, correct hardness, and optimum
size and distribution of polishing particles. |
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CMP Slurries
Featuring Soft•brasive™ Technology—JSR
Micro’s proprietary composite organic/inorganic
particles ensure minimal damage on low-k, with superior
dishing and erosion performance, and no surface scratches. |
