Yokkaichi, Japan
December 4, 2002
Yokkaichi, Japan, December 4, 2002 -- JSR Corporation announced today that construction of its manufacturing facility for chemical mechanical planarization (CMP) polishing pads will be completed on December 18, 2002 and be fully commercialized in 2003. The initial manufacturing capacity of the facility will be 40,000 pads per year with room for future expansion.
The CMP process is one of the vital processes to the production of semiconductor devices, which uses CMP slurries and pads to planarize the surface of wafers. As the critical dimensions of semiconductor devices shrink and the number of metal interconnect layers increases, an advanced pad with high planarization efficiency and low defect performance becomes increasingly important — especially for Cu interconnect and 300mm wafer application.
“JSR’s pads are designed through JSR proprietary elastomer and dispersion technologies,” said JSR Corporation President, Yoshinori Yoshida. “This results in superior planarity and low scratch performance compared to conventional polyurethane type pads.”
The CMP pad market is currently estimated at approximately 20 billion yen (Approximately $160 million) and is expected to increase to 30 to 40 billion yen ($250 to $320 million) due to introduction of Cu interconnect and 300mm wafer applications.
JSR is targeting 30 percent of the worldwide market share through its global infrastructure including facilities in Japan, Korea, Taiwan, China, United States and Europe. JSR is expanding its focus beyond photoresist by enhancing product lines of CMP consumables and materials for back-end processes such as thick photoresists.
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