AUSTIN, Texas
April 3, 2003
AUSTIN, Texas, April 3, 2003 -- Under a supplier agreement between International SEMATECH (ISMT) and JSR Micro, Inc., 300mm test wafers developed with JSR LKD-5109 have been made available for etch, clean, deposition and CMP studies. The wafers will be offered to semiconductor companies through ISMT on a limited basis.
“Porous materials present a number of challenges to the industry at large,” said Brent Ames, manager of Wafer Services for International SEMATECH. “However, the successful implementation and integration of these materials may be the most viable solution for reaching the k values necessary to accommodate future device shrinkage and density goals. We are making these wafers available to give semiconductor companies an opportunity to work on those issues.”
In 2002, ISMT qualified its low-k baseline dual Damascene process flow using JSR LKD-5109 porous spin-on material on 200mm wafers.
“At JSR Micro, we believe that the implementation of low-k is imminent and necessary to meet the challenges of the ITRS,” said Eric Johnson, COO of JSR Micro. “Through our collaboration with ISMT and leading manufacturers, we are confident that the integration issues faced by spin-on dielectrics, such as adhesion and barrier integrity, are solvable and both the materials and process flow will gain the required momentum to achieve market-wide adoption.”
A lower ‘k-value’ dielectric improves chip speed and performance by allowing manufacturers to achieve smaller and higher density semiconductor devices with multi-layer interconnect structures. Spin-on dielectric materials are considered to be an enabling technology that will take the semiconductor industry to the next level in chip performance.
The test wafers are processed using JSR LKD-5109 with the ISMT 700AZ Dual Damascene and 754AZ CMP characterization reticle sets. JSR LKD-5109 will also be available through ISMT as blanket film wafers.
About JSR Micro, Inc. (www.jsrmicro.com)
Sunnyvale, California-based JSR Micro is an innovation partner for leading IC manufacturers. JSR Micro delivers the quality products and technical expertise necessary to support the current needs and future goals of the semiconductor industry. The company advances industry efforts by developing superior semiconductor materials, including advanced photoresists, low-k dielectrics, CMP consumables and packaging materials. JSR Micro began U.S. operations in 1990 and is part of Tokyo-based JSR Corporation. JSR Corporation has more than 4,000 employees worldwide. Additional company and product information is available at JSR Micro’s website at www.jsrmicro.com.
About International Sematech (www.sematech.org)
International SEMATECH (ISMT) is a global semiconductor technology development consortium that has effectively represented the semiconductor manufacturing industry on innovation issues since 1988. Its members are Agere Systems, AMD, Hewlett- Packard, Hynix, IBM, Infineon, Intel, Motorola, Philips, STMicroelectronics, Texas Instruments and TSMC. ISMT conducts state-of-the-art research and development, and is a highly regarded technology partner whose mission is to promote the interests common to all chipmakers. It has extensive experience collaborating with equipment and materials suppliers, as well as government and academic research centers, to refine the tools and technology necessary to produce future generations of chips. For information on ISMT Wafer Services, contact Brent Ames at brent.ames@sematech.org.
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